Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...
When engineers at General Dynamics Armament and Technical Products (GDATP) recently designed the ammunition container for a new aircraft weapon system, they decided very early in the process to make ...
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How a transparent epoxy hood for car is made
A transparent epoxy hood is created through a careful process that combines craftsmanship and precision. Layers of epoxy ...
System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...
VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera Industrial Ceramics Corporation, Chemical Sales Division today announced the introduction of its new environmentally friendly XKE-G5633 Epoxy Molding ...
COLUMBUS, Ohio--(BUSINESS WIRE)--FastRTM, a project of an industry consortium supported by IRT M2P, focused on enabling composite mass production, used a specialty epoxy resin system from Hexion Inc. ...
Epoxies to keep up with fast HP-RTM: This high-pressure RTM equipment in use at specialist vehicle manufacturer Penso Consulting Ltd. in the UK is molding parts with Cytec’s fast-cure epoxy, XMTM710.
Faster, further, more efficient: Developers of e-vehicles and plug-in hybrids are aiming ever higher. The key element of these eff orts is the battery. On the one hand, it must be as ergonomic as ...
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