When merging optical functions, one may need to provide for the continuous propagation of light across a portion of the chip from one structure to another. To minimize or eliminate any trade-offs in ...
Veeco Instruments Inc. and imec announced today that they have collaboratively developed a 300 mm high-volume-manufacturing-compatible process that enables the integration of barium titanate (BaTiO3 ...
The optimisation of process planning has emerged as a pivotal aspect of modern manufacturing, where genetic algorithms (GAs) and hybrid techniques are leveraged to address the combinatorial complexity ...
Molecular electronic devices using quantum tunneling could achieve integration densities 1,000 times greater than silicon chips by combining atomic-precision assembly with three-dimensional ...
Process capability indices (PCIs) have long served as crucial metrics in assessing the performance and quality of manufacturing processes. Recent advances in statistical estimation techniques have not ...
With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...
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