PulseForge’s flux-less approach overcomes these limitations by leveraging the unique physics of Photonic Soldering, where rapid heating significantly limits oxygen penetration during reflow. The ...

The result is that the entire board is much denser, and comments can be installed on both sides of the PC board, as seen in Figure 2 . Since the board does not require drilling for component leads ...

Vacuum reflow soldering technology, although limited in adoption, is emerging as a key focus in high-reliability electronics. While traditional reflow ...

A new 16-zone reflow oven configuration by Kurtz Ersa  is positioning itself as a high-performance option for electronics manufacturers seeking tighter ...

KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is excited to announce its participation in the 2024 IPC APEX EXPO, scheduled to take ...

Access our Reader Service Web site to quickly find and request information on products and services found in the pages of Machine Design. Through-hole reflow (THR) is a recently developed method of ...

Semiconductor die thickness is getting thinner over time due to improvement of power efficiency in advance power electronic packages. Ultrathin die with convex warpage can easily deteriorate the ...

FCI extends its reflow process-compatible D-Sub family of connectors by introducing a new right-angle version for Pin-In-Paste (through-hole) technology. This product line extension will allow ...