A smaller version of existing 16nm technology According to industry sources, TSMC is planning to introduce a 12 nanometer half-node process to enhance competition with 28nm and lower process nodes… A ...

Intel was first to market with backside power delivery.

Intel's newest CEO, Lip Bu-Tan, took the helm in March 2025 and doubled down on its commitment to manufacturing its own chips ...

Accelerates Pathway to Ultra High-Speed 1.6Tbps Bandwidth for Build Out of the Next Generation of Cloud Computing, AI, and Hyperscale Networks SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology ...

AI money rules all.

Vanguard International Semiconductor (VIS) announced on 28 January that it had signed a technology licensing agreement with TSMC covering 650V high-voltage and 80V low-voltage GaN process technologies ...

The company will boost its capital expenditure, which includes big-ticket purchases such as lithography machines, to expand its advanced node capacity. TSMC expects to invest between $52 billion and ...

TSMC has continued to ramp up investment in advanced packaging. According to Commercial Times, alongside its transition to a ...

Ansys secured an award in the category of Joint Development of 2nm and N3P Design Infrastructure for delivering foundry-certified, state-of-the-art power integrity and reliability signoff verification ...

The new 224G PAM4 IP offering brings Credo’s high-performance, power-efficient SerDes technologies with fabrication on an industry-leading advanced process technology from TSMC to provide the ...

The Intel 18A process is in production and features a critical technology currently exclusive to Intel. Backside power delivery moves power circuits to the back of the chip, unlocking additional ...