Design with confidence at 48 Gbps: A low noise measurement floor enables accurate jitter, electrical, and timing analysis of PAM3 encoding, empowering customers to validate next-generation high-speed ...
SANTA ROSA, Calif. -- Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the ...
Headquartered near Stuttgart, Germany, TES Electronic Solutions GmbH serves a global customer base, with design operations in Stuttgart and graphics IP development in Hamburg. Learn more at ...
Global semiconductor sales surged to a new high in 2025, underscoring the scale and speed of the industry’s rebound. According to the European Semiconductors Industry Association ( ESIA ), worldwide ...
GF’s industry-leading FDX platform is ideally suited for applications in Physical AI that are optimized for long battery life in small form factors, thanks to its ultra-low power and low leakage ...
Compartmentalisation is a modern security approach where software is divided into small, well-bounded modules, and each ...
South Korean radar specialist bitsensing has launched an aftermarket ADAS aimed at upgrading existing buses, trucks and heavy goods vehicles with advanced driver warning functions. The ADAS Kit ...
FinFET technology enabled lower leakage, reduced short-channel effects, and better performance at reduced voltages. It successfully extended CMOS scaling from the 22nm node through the 7nm generation ...
According to the organization’s 2025 Annual Report, RISC-V’s market share is expected to grow from 2.5% in 2021 to 33.7% by 2031. This rapid growth is driven by countries like China and India using ...
At the show, EnSilica will demonstrate how complex system requirements are translated into production-ready ASICs, covering system architecture, mixed-signal and RF design, verification, test, ...
San Jose, CA / Santa Clara, CA – SmartDV and Mirabilis Design today announced a strategic collaboration to deliver system-level models of SmartDV IP, enabling SoC architects and system designers to ...
Fraunhofer IPMS develops new 10G TSN endpoint IP Core for deterministic high-speed Ethernet networks
As part of the CeCas funding project, Fraunhofer IPMS is developing a supercomputing platform for highly automated automobiles and testing 25G TSN solutions. In addition to the new 10G TSN-EP IP Core, ...
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