With the dynamic growth and ubiquity of electronic systems globally, software-defined, AI-powered, and silicon-enabled technologies are critical for today’s semiconductor industry, which is projected ...

The new platform presents Harwin’s components in an interactive 3D environment, allowing users to rotate and inspect products ...

Renesas Electronics has developed three new system‑on‑chip (SoC) technologies designed to power the next generation of ...

Amphenol RF has added new MMCX cable assembly options to its product line, introducing both straight and right‑angle plug ...

HAETAE is positioned as a flagship partnership linking European photonics laboratories with advanced semiconductor specialists in South Korea. Moralis said the initiative reflects a wider trend ...

Nvidia agrees multiyear agreement to provide Meta Platforms with millions of its current and next‑generation AI chips.

ROHM has added a new compact package option to its range of 40V and 60V automotive MOSFETs, targeting applications such as main inverter control circuits, electric pumps and LED headlights. The latest ...

STMicroelectronics has introduced two new automotive‑grade isolated gate drivers for EV and hybrid vehicle systems.

TASKING has unveiled new upgrades to its unified development toolchain aimed at improving worst‑case timing and coupling analysis for real‑time multicore embedded systems used in safety‑critical ...

HARTING Technology Group has expanded its PushPull connector portfolio with the launch of the PushPull V4 Power QuickLock, a new model designed to simplify power connection in industrial and outdoor ...

Renesas Electronics has announced a new ternary content‑addressable memory (TCAM) technology built on a 3nm FinFET process.