Semiconductor packaging has progressed from 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving single micronmeter level interconnecting pitches and over 1000 GB/s bandwidth.

Increased efficiency and flexibility are two increasingly desirable qualities of photovoltaics, and the implementation of new materials and form factors could reshape the landscape of solar energy.

In the shadows of a silicon-dominated field, other photovoltaic (PV) technologies have been edging closer to the spotlight. Emerging PV applications, such as indoor ...

Aroma Bit is a developer of leading-edge olfactory aroma sensors that can digitize the sense of smell, as a technology startup they invented a small sensor that can digitize smell, R&D teams across ...

The EV revolution is driving demand for a huge variety of materials used in battery cells and packs. With new chemistries emerging to bridge cost and energy density gaps, the landscape is evolving ...

IDTechEx analyst Dr Conor O'Brien covers the outlook for graphene through to 2036. IDTechEx has conducted market research on graphene for over ten years. The new report Graphene & 2D Materials ...

Integrating multiple functionalities within a single entity promises simpler, more efficient devices without compromising capability. Smartphones are a great example, with maps, diaries, phones, ...

Take-out in boxes fermented from bacteria, ketchup squeezed from seaweed, oil spills cleaned with aerogels derived from wood pulp- these seeming technologies of the future are already being ...

When it comes to history and awareness, polymer additive manufacturing leads the 3D printing industry. The first type of 3D printing to be invented in the 1980s was stereolithography, while ...

Metamaterial Market: Growth Opportunities Across Radio-Frequency and Optical Metamaterials IDTechEx's new research report, "Metamaterials Markets 2023-2043: Optical and Radio-Frequency", analyses the ...

Philips Design has developed a series of dynamic garments as part of the ongoing SKIN exploration research into the area known as 'emotional sensing'. The garments, which are intended for ...

The increase in demand for high performance computing is resulting in the need for enhanced semiconductor performance, of which thermal management is a large component. IDTechEx's report, "Thermal ...