Abstract: CMOS Imagers have adopted 3D integration using Back-Side Illumination (BSI) technology, with 2 CMOS layers assembled using Wafer-to-Wafer and advanced Hybrid Bonding technology. Targeting ...
Abstract: Fan-out wafer level packaging (FOWLP) is one of the latest technologies to meet the requirements of high performance and thin form-factor, especially for mobile application processors. To ...
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