Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...

For manufacturers, RoboDK CAM enables faster automation rollouts, reduced downtime, and quicker iteration on machining processes. For system integrators, the software shortens project timelines and ...

Production line modifications have increased output capacity for Gear Rack components from 15,000 units monthly to 24,000 units without additional floor space. This improvement stems from redesigned ...

Leading manufacturers are responding not with generic devices, but with precisely engineered solutions tailored to distinct ...

A male fruit fly in a laboratory chamber extends his wings and vibrates them to produce his species' version of a love song.

Before speaking with Professor Jae Woo Lee, I had gotten to know him through dozens of campus message board posts and professor reviews of his infamous course, Advanced Programming. According to a ...