IEEE

Development of 0.5 μm Pixel 3-Wafers Stacked CMOS Image Sensor with through Silicon Deep Contact and In-pixel Cu-Cu Bonding Process

Abstract: Recently, we have successfully developed the novel 3-wafers stacked & 64MP pixel CMOS image sensor (CIS) with 0.5um pixel including through silicon deep contact module and face-to-back Cu-to ...
IEEE

6.10 A 1/1.56-inch 50Mpixel CMOS Image Sensor with 0.5μm pitch Quad Photodiode Separated by Front Deep Trench Isolation

Abstract: CMOS image sensors (CISs) in high-end mobile devices require wide dynamic range and superior image quality under extremely low light conditions [1]. To implement high-resolution sensors that ...
HealthLeaders Media

The Exec: How CMOs Can Successfully Promote High Quality Care

The most important factor in promoting high quality is making sure every staff member is focused on that goal, according to ...