This integration addresses the fundamental barriers that have historically limited formal verification adoption: complexity ...

The EPC2366 40 V eGaN® FET sets new benchmarks in performance, efficiency, and power density for next-generation power electronics. The EPC2366 showcases our ongoing commitment to help engineers ...

As of Wednesday, February 11, Diodes Incorporated’s DIOD share price has surged by 26.95%, which has investors questioning if this is right time to sell.

In today’s advanced packages, however, resistance no longer resides primarily inside transistors or neatly bounded test ...

Prime Minister Narendra Modi's visit to Malaysia on 7 February 2026 is poised to become a pivotal chapter in India's ...

A tiny optical booster built directly onto a chip is pointing toward a future where light, not just electricity, does the ...

CDimension’s technology, which enables semiconductor makers to manufacture arrays of extremely small, fast, and efficient “2D” transistors, has the potential to change what’s possible for both digital ...

Intel's 18A process is built around the Backside Power Delivery Network, or BSPDN, a structural overhaul known inside Intel as PowerVia. Instead of routing power through ...

Smartkem, Inc. ( Nasdaq: SMTK ), (“Smartkem”), a developer of advanced materials, today announced that it has entered into a non-binding letter of intent (“LOI”) to acquire 100% of the outstanding ...

Molecular electronic devices using quantum tunneling could achieve integration densities 1,000 times greater than silicon chips by combining atomic-precision assembly with three-dimensional ...

Combination leverages SomaScan with Illumina's NGS ecosystem, DRAGEN software, and Illumina Connected Multiomics to rapidly transform insights into discoveries SAN DIEGO, Jan. 30, 2026 /PRNewswire/ -- ...