Hefei National Laboratory for Physical Sciences at the Microscale, Department of Chemistry, University of Science and Technology of China, Hefei, Anhui 230026, China ...
Abstract: The solder-based interconnections have been the backbone of microelectronics. However, the ever-growing trends toward ultrahigh-density interconnected systems with higher thermal and ...
Abstract: Developing hybrid bonding technology is a key challenge for fine pitch 3D integrations, enabling high performances and reliability. For the realization of interconnects in 3D integration, ...
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