Metal alloys crack and fail through a mechanism called "fatigue" when repeatedly loaded and strained. While it is well known how to design alloys to withstand static loads and pressures, it is very ...
Abstract: With the fast development trend of highly integrated electronic products, as the key technology of 3-D interconnect circuits, the research on monolithic intertier via (MIV) testing ...
THIRUVANATHAPURAM: In a development that could pave the way for construction of longer-lasting roads in vulnerable stretches, ...
Abstract: Dynamic channel models are under extensive investigation to provide a more accurate modeling of varying interaction between wireless transceivers and propagation environments. On the other ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results