TDK said the DC-DC converter is already used in Altera’s Agilex family of FPGAs and AMD’s programmable SoCs, including ...

Chrysler, operating as FCA US, LLC, has filed a safety recall covering 456,287 vehicles across its Ram truck and Jeep lineups ...

The Daniamant DanEI-300 electronic inclinometer has achieved IMO Wheelmark (Marine Equipment Directive) approval, becoming the ...

Scientists built a light powered AI prototype that matches chip accuracy while using less energy and producing less heat.

InstantGMP Named #1 for EBR, LIMS & MES Integration Being recognized by Root Analysis as the number one provider of ...

Kontron will present its portfolio of powerful, secure, and scalable embedded and Edge AI solutions at embedded world 2026.

The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.

Abstract: Power module packaging technologies have been experiencing extensive changes as the novel silicon carbide (SiC) power devices with superior performance become commercially available. This ...

A key problem facing artificial intelligence (AI) development is the vast amount of energy the technology requires, with some ...