Avalanche Technology, the leader in MRAM technology, today announced the introduction of its groundbreaking next-generation ...
Congatec conga-TCRP1 is a COM Express 3.1 Type 6 Compact module powered by the newly announced AMD Ryzen AI Embedded P100 ...
Operational technology systems are not ready for the recent NIST cybersecurity standards. Given the constraints, ...
A seed-stage startup from the bottom of the world has built custom solid-state hardware that delivers an order-of-magnitude ...
A cartridge-based console project that blends Arduino fundamentals, retro gaming nostalgia, and modern maker tools.
AMD Kintex UltraScale+ Gen 2 is a mid-range FPGA family designed for the broadcast, test, industrial, and medical markets, ...
Enabling higher power within the same rack space, Microchip’s MCPF1525 power module delivers up to 25 A per device, stackable ...
The global High Bandwidth Memory (HBM) market is experiencing explosive growth driven by AI demand. The industry is heavily investing in 3D-stacked memory architecture (TSV technology) and advanced ...
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