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Smiths Interconnect’s high-power burn-in socket is a specialized electromechanical interface designed to temporarily connect a semiconductor device (like a CPU, GPU, AI accelerator or high-power ...

Scheduled for March 2026 with DPhi Space and The Compression Company Most space software treats orbit as a destination.

If you're looking for a laptop suitable for engineering, 3D rendering, CAD, and AI workloads, then I strongly recommend checking out the Lenovo ThinkPad P16 Gen 3, now $3929 (was $5529) at Lenovo.

Apple is set to host its first major hardware moment of 2026 with a March 4 'Apple Experience' media event, an invite-only showcase ...

The AMD Ryzen 7 9850X3D is what a “refresh” should look like when the base product is already strong. It keeps the platform consistent for AM5 users, holds the same cache configuration that makes X3D ...

During the fourth quarter of 2025, the largest portfolio sector weightings were Information Technology and Communication ...

The Asus Vivobook is one of the most affordable laptops with Qualcomm's Snapdragon silicon and a Copilot+ badge for AI chops. It's a utilitarian workhorse that occasionally stumbles, but gets the job ...

A new variant of ASRock’s Radeon RX 9070 XT Taichi White has appeared in early coverage, and it adds a feature ASRock hasn’t ...

OpenNebula Systems is the developer of OpenNebula, an open and vendor-neutral cloud management and virtualization platform for private, hybrid, and edge infrastructures. The company provides SLA-based ...

Anyone writing reviews on Steam can now also attach their hardware specifications. This is intended to help make user tests ...

How advanced UPS controls stabilize AI driven power fluctuations while protecting batteries and upstream infrastructure in ...