The LPCAMM2 design is part of an ongoing effort to replace soldered LPDDR in mobile and ultra-thin systems with memory that is both upgradeable and space-efficient.
The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.
NuScale Power Corporation announced today that it will partner with Oak Ridge National Laboratory (ORNL) to utilize an artificial intelligence (AI)-enabled nuclear design framework for a 12-NuScale ...
The Coroner’s own recommendations, issued under section 57A of the Coroners Act, were explicit: urgent, practical and targeted change is needed. Those recommendations sit alongside Dame Poutasi’s, the ...
Abstract: Double-sided cooled (DSC) power module structures enable high power density for motor drive inverters ideal for electric vehicles (EVs). This work presents a DSC power module using ...
Abstract: Wire-bonding type power modules are among the most widely used power semiconductor module packages in recent years, with bonding wires being one of the weakest links in these modules. Under ...
Dublin, Jan. 28, 2026 (GLOBE NEWSWIRE) -- The "Power Discrete and Module Market Report 2026" has been added to ResearchAndMarkets.com's offering. The report offers insights into market size, regional ...
As global energy demand surges—driven by AI-hungry data centers, advanced manufacturing, and electrified transportation—researchers at the National Renewable Energy Laboratory have unveiled a ...
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