Abstract: The importance of thermal interface materials (TIMs) has become increasingly critical due to the substantial rise in power and power density within 2.5D/3D high-performance computing (HPC) ...
Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
FZE DIGITYZE SOLUTIONS PRIVATE LIMITED is a Private Limited Company, governed by the Companies Act as a company limited by shares. Classified as a Non-government company, it is registered under the ...
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