However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and adhesion between the lid, sTIM, and the module. Conventional BSM processing ...

USI and Amcor launch a Spring 2026 pilot bringing students and industry experts together to develop real-world packaging concepts.

For many businesses, packaging compliance only comes into focus when it causes disruption—through delays, audits, redesigns, or unexpected environmental costs.

SANTA CLARA, Calif. --The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, today reported on its 2026 Best of Show Awards at the Santa Clara Convention Center.

Ford's F-Series trucks still had inline-sixes, too. But this was the era where even Mercedes was preparing to ditch its inline-six range in favor of a V layout. So, apart from BMW, the majority of ...

Husky Technologies introduces Hylectric and HyperSync molding platforms designed for sustainable packaging production ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Onto this field steps the all-new 2026 Toyota C-HR (not to mention the C-HR's Subaru Uncharted twin), an old, somewhat obscure nameplate reimagined specifically for the battery-electric age. Rather ...

Once packaging leaves the consumer, it enters fragmented collection and sorting systems where contamination, infrastructure gaps, and market forces determine its fate.

When it comes to mastering the art of the travel wardrobe, it’s no surprise that our favorite fashion insiders also moonlight ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

Inside the work of Abrams Climate Academy Fellows striving to transform packaging waste and climate tech funding into powerful levers for change.