The result is that the entire board is much denser, and comments can be installed on both sides of the PC board, as seen in ...

The YRH10W hybrid placer is a wide-type placement system designed to support both semiconductor die bonding and surface-mount component placement within one platform. Expands capability to accommodate ...

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[Kalesh Sasidharan] from Sciotronics wrote in to tell us about their project, Stamp: a modular set of template breakout boards designed to make prototyping with SMD components faster, easier, and more ...

This article originally appeared on TV Tech sister brand Radio World. With the U.S. economy in a state of flux as the Trump Administration tightens — and subsequently laxes — the flow of imports into ...

A manufacturer’s perspective on determining parts layout. A land pattern refers to the footprint or layout of surface-mount components on a printed circuit board (PCB). It includes the arrangement of ...

New X.PAK packaging combines high thermal performance, compact size, and easy assembly for high-power applications Nexperia has introduced a range of industrial grade 1200 V SiC MOSFETs in ...

ABSTRACT: This study applies Principal Component Analysis (PCA) to evaluate and understand academic performance among final-year Civil Engineering students at Mbeya University of Science and ...

Designed for durability in harsh environments, these transformers function reliably across a broad temperature range from −40 °C to +150 °C. TDK Corporation introduces the EPCOS EP9 series (ordering ...