Abstract: Statistical Machine Translation (SMT), as part of an overall human-centered machine translation process, provides a significant opportunity for multilingual access to digital content, such ...
Abstract: Solder paste is the main interconnect material to use between FBGA type packages and main boards. It is consisted of different types of solder powers (in case of type 3 size is 25~45um) and ...
January 21, 2026-- ASMPT Announces Assessment of Strategic Options for SMT Solutions Segment ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for ...
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