Many things about diamonds seem eternal, including the many engineering problems related to making them work as a silicon ...
The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.
A technical paper titled “Test Generation for Subcircuits with High Functional Switching Activities” was published by Irith Pomeranz at Purdue University. Abstract “Chip aging results in defects that ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results