Many things about diamonds seem eternal, including the many engineering problems related to making them work as a silicon ...
The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.
A technical paper titled “Test Generation for Subcircuits with High Functional Switching Activities” was published by Irith Pomeranz at Purdue University. Abstract “Chip aging results in defects that ...
Subsea technology and services company, SMD, has reached an important milestone with its pioneering electric work class ROV, the SMD Quantum EV. Site Acceptance Testing (SAT) at DEEP Campus, near ...
Abstract: Uncertainties have become a major concern in integrated circuit design. In order to avoid the huge number of repeated simulations in conventional Monte Carlo flows, this paper presents an ...
Abstract: Following the pivotal success of 3-D NAND technology, which revolutionized flash memory, DRAM technology could similarly advance by adopting vertical stacking of memory cells, employing gate ...
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