XDA Developers on MSN

Why I stopped buying official ESP32 developer boards and what I use instead

They're reference designs for a reason.
IEEE

A Fast and Intelligent Monitoring of Solder Layer Degradation in Multichip IGBT Modules Based on Copper Substrate Temperature Field Reconstruction

Abstract: Fatigue-induced delamination of the direct-bonded copper solder layer is a critical and latent failure mode in multichip insulated gate bipolar transistor (IGBT) power modules. To address ...
IEEE

Enhancing Solder Joint Fatigue Life in a Radar Transmit/Receive Module via Vibration Reduction using a Particle Damper in the PCB Enclosure

Abstract: Transmit/receive (TR) modules in active electronically scanned array radar systems face critical vibration-induced fatigue issues, which are further aggravated by elevated operational ...

Introducing the GameBox Clicker: a 'modular magnet key game console' made out of a fidget toy

"This project is not about powerful hardware or complex graphics." ...
EE World Online

Spring pin test socket supports –40 °C to +150 °C DFN2 device testing

Ironwood Electronics has released a new spring pin test socket for DFN2 packages. The socket is engineered to support up to ...