The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.
The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
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Abstract: Rapid and accurate classification of surface defects in the strip steel production process contributes to reducing production costs in factories. In this article, a dual feature-integration ...
In this study, we propose a novel defect localization method that integrates the graph neural network (GNN) with the finite element method (FEM) to estimate the three-dimensional location of defects ...
Abstract: Accurate surface defect classification is essential for industrial quality inspection but remains challenging due to the scarcity of annotated samples, high annotation costs, and significant ...
ABSTRACT: To address the issues of missed detection and false detection during the defect inspection process of the PCB, an improved YOLOv7-based algorithm for PCB defect detection is proposed.
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