Semiconductor Engineering

Resistance In Advanced Packages Is Now A System-Level Problem

In today’s advanced packages, however, resistance no longer resides primarily inside transistors or neatly bounded test ...

Freshsales CRM review

Freshsales CRM stands out for its user-friendly interface, comprehensive core capabilities, and flexible pricing model. The ...
IEEE

Electric Drive System for Hybrid Power Vehicles Based on the Doubly-Fed Induction Generator Direct-Drive Induction Motor Structure: Integration and Control Algorithm

Abstract: This paper proposes a hybrid electric vehicle (HEV) transmission system using a doubly-fed induction generator (DFIG) that directly drives an induction motor (IM). The purpose is to reduce ...
FMIBlog

Chiplet Architectures and Advanced Packaging Redefine the U.S. Semiconductor Assembly and Testing Industry

U.S. semiconductor companies were among the first to respond by disaggregating large chips into smaller, specialized chiplets ...
IEEE

NISAR S-SAR Payload: Overview of Final Stages of Ground Testing

Abstract: ISRO and JPL-NASA have jointly developed multi-disciplinary Earth Observing L&S band SAR Mission, planned to be launched through GSLV in 2025. The NASA-ISRO Synthetic Aperture Radar (NISAR) ...