Forget traveling with multiple chargers. Here's why I charge my iPhone, Apple Watch, and AirPods with the InfinaCore T3.
Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
Abstract: The importance of thermal interface materials (TIMs) has become increasingly critical due to the substantial rise in power and power density within 2.5D/3D high-performance computing (HPC) ...
A fully customizable terminal-style UI toolkit for Flutter that brings the power and aesthetics of command-line interfaces to your mobile and desktop applications. To integrate similar functionality ...