Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, ...

Samsung starts mass production of HBM4 memory with up to 3.3 TB/s bandwidth, 40% better efficiency, and confirmed AI GPU adoption.

AI demand is tightening memory supply and driving sharp price swings, creating windfalls for traders while forcing China’s tech firms into an increasingly volatile market.

The hunt is on for anything that can surmount AI’s perennial memory wall–even quick models are bogged down by the time and energy needed to carry data between processor and memory. Resistive RAM (RRAM ...

Intel said that it's working with a Japanese DRAM company, Saimemory, to use available DRAM effectively by stacking it vertically.

We put these sneakers, slides, and boots to the test. Haven't taken 'em off yet.

Intel joins forces with SoftBank and its subsidiary SAImemory on next-gen ZAM: Z-angle memory with memory design driven by ...

Crisp home fries and that cozy diner rhythm make this Delaware stop unforgettable, the kind of breakfast memory that sticks ...

First social network to let users spend content earnings instantly at 80+ million merchants worldwideLONDON, Feb. 11, 2026 /PRNewswire/ -- Wirex, a full-stack crypto card issuer and Banking-as-a-Servi ...

At a recent Bengaluru mixer hosted by E2E Networks, NVIDIA, and YourStory, founders and ecosystem builders unpacked the real ...

AI inference, reasoning, and larger context windows are driving an unprecedented surge in demand for both high-bandwidth memory (DRAM) and long-term storage, making memory a critical bottleneck in AI ...

Intel (NasdaqGS:INTC) has entered an AI-focused collaboration with SoftBank subsidiary Saimemory to develop next-generation Z ...