IEEE

Development of 0.5 μm Pixel 3-Wafers Stacked CMOS Image Sensor with through Silicon Deep Contact and In-pixel Cu-Cu Bonding Process

Abstract: Recently, we have successfully developed the novel 3-wafers stacked & 64MP pixel CMOS image sensor (CIS) with 0.5um pixel including through silicon deep contact module and face-to-back Cu-to ...
IEEE

Modeling and Analysis of Litz Wire Radio Frequency (RF) Coil in Inside-Out NMR Well Logging Sensor

Abstract: Nuclear magnetic resonance (NMR) well logging is an important method of oil measurement, and the radio frequency (RF) coil is an important component for obtaining accurate parameters of rock ...