Abstract: CMOS Imagers have adopted 3D integration using Back-Side Illumination (BSI) technology, with 2 CMOS layers assembled using Wafer-to-Wafer and advanced Hybrid Bonding technology. Targeting ...
The advent of generative AI has revolutionized 3D content design, significantly enhancing modelers’ efficiency. However, the quality of generated 3D content, particularly Generated Meshes (GMs), ...
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