Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...

The UK TV industry has revamped its Diamond diversity data monitoring system and those working on TV shows will now only have to fill in one form that can be linked to future projects. In the past, ...

For years high school swim teams from the Tri-Cities have had to drive all over central Washington to find a pool to practice in. Often they would return home late at night, even in winter. This ...

MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Diamond Quanta today announced Adamantine Thermal™, an engineered-diamond thermal platform designed for integration into advanced packaging workflows and ...