Intel's 18A process is built around the Backside Power Delivery Network, or BSPDN, a structural overhaul known inside Intel as PowerVia. Instead of routing power through ...

Smartkem, Inc. ( Nasdaq: SMTK ), (“Smartkem”), a developer of advanced materials, today announced that it has entered into a non-binding letter of intent (“LOI”) to acquire 100% of the outstanding ...

Molecular electronic devices using quantum tunneling could achieve integration densities 1,000 times greater than silicon chips by combining atomic-precision assembly with three-dimensional ...

CDimension’s technology, which enables semiconductor makers to manufacture arrays of extremely small, fast, and efficient “2D” transistors, has the potential to change what’s possible for both digital ...

The EPC2366 40 V eGaN® FET sets new benchmarks in performance, efficiency, and power density for next-generation power electronics. The EPC2366 showcases our ongoing commitment to help engineers ...

Lightwave Logic ( (LWLG)) has provided an announcement. On December 15, 2025, Lightwave Logic, Inc. announced an underwritten public offering of 11,666,667 shares of its common stock priced at $3 per ...

Abstract: This article presents a novel capacitorless DRAM (CL-DRAM) based on a complementary transistor architecture through numerical simulations. By leveraging the complementary operation of ...

Recall that a transistor is an electrically-controlled switch. Let’s explore that in a little more detail. We’ll look at simplified views of transistors which are at the heart of all logic and ...

Electric-field-assisted assembly enables scalable, lithography-free fabrication of logic circuits using 2D semiconductors. It provides a practical route to high-performance electronics beyond ...

Before the era of large-scale integration (LSI) semiconductor circuits, discrete logic circuits using the common diode-transistor logic (DTL) were still necessary and available in a format that was ...