Semiconductor Engineering

Resistance In Advanced Packages Is Now A System-Level Problem

In today’s advanced packages, however, resistance no longer resides primarily inside transistors or neatly bounded test ...
IEEE

Design Method of Distributed Decoupling Capacitors for Both Voltage Overshoot Suppression and Dynamic Current Sharing in SiC MOSFET Power Module

Abstract: The Silicon Carbide (SiC) MOSFET is widely recognized for its exceptional performance attributes. However, two primary issues restrict the operational capabilities of SiC MOSFET power ...
IEEE

Design of Distributed Nonlinear Observers Without Using Global Inputs

Abstract: This article investigates the design of distributed observers for a class of nonlinear systems. The designed distributed observers reside in a network of sensor nodes. The communication ...