AI agents can handle physics-based modeling complexity while engineers focus on design judgment and tradeoffs.

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip DesignCompany opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep ...

While some consider prompting is a manual hack, context Engineering is a scalable discipline. Learn how to build AI systems that manage their own information flow using MCP and context caching.

Nitya Bathula is driving a new approach to software creation at D3E Studio, where applications are built through AI, visual ...

Mydbops announces its strategic focus on Database Reliability Engineering to help SaaS companies improve database ...

Residents and community advocates desperate for help in the flood-prone Rockcliffe-Smythe area are urging the city to ...

Most 3D design software requires visual dragging and rotating—posing a challenge for blind and low-vision users. As a result, a range of hardware design, robotics, coding, and engineering work is ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

AI agents capable of handling large portions of chip design and verification are less about convenience and more about maintaining a competitive edge globally.

Chipagents raises $74m to scale agentic ai for semiconductor design as demand rises for faster, more reliable silicon workflows.

After years of rapid advancement in cloud‑centric AI training and inference, the industry is reaching an edge AI tipping point.