However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and adhesion between the lid, sTIM, and the module. Conventional BSM processing ...

High-performance computing (HPC) systems, with enormous computational capabilities, have been the go-to solution for decades ...

In an era where supercomputers perform at unprecedented speeds, their immense GPU energy consumption has become a critical challenge. Research from Oak Ridge National Laboratory has demonstrated a ...

Abstract: Matrix-accelerated stencil computation is a hot research topic, yet its application to 3 dimensional (3D) high-order stencils and HPC remains underexplored. With the emergence of Scalable ...

The cluster architectures for AI training and inference are driving unprecedented growth in the datacenter infrastructure spending, but they are also having a reflective and beneficial impact on HPC ...

Perma-Pipe International Holdings is a specialized pipe manufacturer, operating primarily in the Middle East and North America. PPIH is poised to benefit from increased capital expenditures in the ...

STMicroelectronics raises the performance bar for embedded edge AI and industrial applications with the new STM32V8 high-performance microcontrollers (MCUs) for demanding industrial applications such ...

For the past two years now, we have been picking apart the semi-annual rankings of supercomputers known as the Top500 is a different way, focusing on the new machines that come into each list in ...

ECMWF and European Partners win prestigious HPCwire Award for "Best Use Of AI Methods for Augmenting HPC Applications” – for AI Innovation in Weather and Climate St. Louis, Missouri, 17 th November ...

As AI models and computing demands continue to grow exponentially, the biggest challenge in chip design is no longer pure processing power, but the bandwidth gap between processors and memory. Even ...