(RTTNews) - Icom Inc. (6820.T), a Japanese wireless communication equipment manufacturer, Friday announced that it has unveiled VHF marine transceiver IC-M430 and the black box AIS transponder ...

Earlier this week, John Cena made history in his hometown of Boston, winning the WWE Intercontinental Championship for the first time in his career. The epic moment, featured on "Monday Night Raw," ...

DUBAI, United Arab Emirates--(BUSINESS WIRE)--Under the patronage of His Highness Sheikh Mohammed bin Rashid Al Maktoum, Vice President and Prime Minister of the UAE and Ruler of Dubai, ICOM Dubai ...

World experts explore how cultural institutions adapt to fast-changing societies The conference provided an unprecedented platform for exchange, learning, and collaboration across the global museum ...

His Highness Sheikh Hamdan bin Mohammed bin Rashid Al Maktoum, Crown Prince of Dubai, Deputy Prime Minister and Minister of Defence of the UAE, and Chairman of The Executive Council of Dubai, ...

DUBAI, United Arab Emirates--(BUSINESS WIRE)--HH Sheikh Hamdan bin Mohammed bin Rashid Al Maktoum, Crown Prince of Dubai, Deputy Prime Minister, Minister of Defence, and Chairman of The Executive ...

Event features award for sustainable practices, revision of code of ethics Medea S. Ekner, Prof. Emma Nardi, Hala Badri and Nasir Al Darmaki outline the significance of the event. Photo: Ashwani Kumar ...

WWE RAW in Boston kicked off with John Cena & Triple H, but soon Dominik Mysterio made his biggest mistake. Dirty Dom confronted the Franchise Player, and the Game immediately booked an IC Title match ...

Apple has bought IC Mask Design, a firm specializing in the layout of chips and processors. Apple is continuously acquiring companies, and most recently appears to have been buying ones concerned with ...

Accurately estimating the junction temperature of a semiconductor device is essential for ensuring its reliability, performance, and longevity. Junction temperature has a direct influence on the ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...