TSV-Aware Analytical Placement for 3-D IC Designs Based on a Novel Weighted-Average Wirelength Model
Abstract: Through-silicon vias (TSVs) are required for transmitting signals among different dies for the 3-D integrated circuit (IC) technology. The significant silicon areas occupied by TSVs bring ...
Abstract: This paper presents an RF-DC converter integrated circuit (IC) with ~307-μW output power capable of powering individual health monitoring systems. The IC is designed with an on-chip adaptive ...
1. Presentation of the software. Icom IC-PCR100 Remote is a program designed for the Linux environment. It has been developed to optimise the reception of SSTV images sent from the ISS by astronauts.
Softing Industrial is now a certified partner of INSYS Icom, succeeding DELTA LOGIC Automatisierungstechnik GmbH, which was ...
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