Abstract: This paper proposes a highly integrated multichip silicon carbide (SiC) MOSFET power module packaging with optimized electrical and thermal performances. The structure of the module is to ...
With @module-federation/vite, the process becomes delightfully simple, you will only find the differences from a normal Vite configuration. In this remote app configuration, we define a remoteEntry.js ...
Miui apps and blobs are owned by Xiaomi™. The MIT license specified here is for the Magisk Module only, not for Miui apps and blobs. Do not white list those ...
Abstract: Silicon carbide (SiC) power module with paralleled multi chips is driven by the demand for compact size and high-power density in some emerging applications, especially electric vehicles.
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