The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...

The government must provide notice and a hearing in many, but not all, cases. The text of the Constitution is clear and so is the Supreme Court: All non-citizens on U.S. soil must be afforded "due ...

Even though Ford has already announced the Mustang GTD and even shown it off at various events, the car is still undergoing testing at the Nürburgring. It seems fine-tuning steering, brakes, and ...

DISCO Corporation has developed a KABRA ingot slicing method specially optimised for the production of GaN wafers. In the KABRA process (shown above), a separation layer (KABRA layer) is formed at a ...

Abstract: In response to the lack of on-line monitoring of process stability in the traditional lapping process, the limit device of the workpiece was retrofitted to reflect the process stability in ...

1 Department of Mechanical Engineering, Inha University, Incheon, Republic of Korea. 2 Division of Mechanical Engineering, Inha University, Incheon, Republic of Korea. Recently, semiconductor ...

The provider of sapphire substrates has secured a patent to ensure the platens facing the wafers are continuously self-conditioned and self-optimised Rubicon Technology has had its patent application ...