Abstract: This paper presents the design and proof of concept validation of an integrated SiC MOSFET bidirectional switch, aiming to deliver high electro-thermal and electro-magnetic performance, ...
Abstract: The parasitic inductance and dynamic current sharing performances of multichip silicon carbide power module packaging limit the device's performance. Moreover, high electrical properties ...
For the PDF version of this feature, click here. In most modern power semiconductor applications there is a need to carefully manage heat. This is true in fields as diverse as mobile communications, ...
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