The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.

Abstract: The lifetime of power modules is affected by degradation of the emitter connection and die-attach material. Increasing requirements on power modules e.g., higher power density, requires ...

NuScale Power Corporation announced today that it will partner with Oak Ridge National Laboratory (ORNL) to utilize an artificial intelligence (AI)-enabled nuclear design framework for a 12-NuScale ...

The Coroner’s own recommendations, issued under section 57A of the Coroners Act, were explicit: urgent, practical and targeted change is needed. Those recommendations sit alongside Dame Poutasi’s, the ...

Abstract: Organic Direct-Bonded-Copper (ODBC) is a novel packaging technology for power modules which allows higher flexibility in layout design. In this work, a set of rapid prototyping techniques ...