This new technical paper titled “End-to-end deep learning framework for printed circuit board manufacturing defect classification” is from researchers at École de technologie supérieure (ÉTS) in ...
The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
The global electronics manufacturing industry is undergoing rapid transformation. The increasing complexity of devices, shrinking component sizes, and the rise ...
Most electronic assembly lines produce some defects, or faults. For example, solder-paste printers may deposit excess, smudged, or insufficient quantities of solder, and component pick-and-place ...
As electronic products move from prototyping to mass production, manufacturers must rely on efficient, scalable, and ...
Geopolitical tensions and pandemic-related disruptions have revealed deep vulnerabilities within the supply chain for manufacturers as well as the businesses and governments that rely on them. In ...
Manufacturing challenges below 8mil. When drill to trace spacing falls below 8 mil, the PCB moves into a far more complex manufacturing zone. Standard mechanical drilling is often insufficient, and ...
The evolution of PCBs from large and antiquated “printed wiring boards” to today’s fine-line designs on high-density interconnect (HDI) PCBs, IC substrates (ICS) and more, has been matched by ...
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