Once packaging leaves the consumer, it enters fragmented collection and sorting systems where contamination, infrastructure gaps, and market forces determine its fate.

Amcor and University of Southern Indiana launch pilot program connecting students with packaging industry professionals ...

Research authored by partners from the Bottle Consortium and published in Nature Communications this month aims to challenge ...

What does Glenfiddich's bold new look owe to its 1960s roots? Discover how the Speyside icon is honouring 139 years of ...

Husky Technologies introduces Hylectric and HyperSync molding platforms designed for sustainable packaging production ...

The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, today reported on its 2026 Best of Show ...

CODAF has unveiled its Brand Audit Report to assess the impact of plastic waste on the environment in Lagos, Delta, Plateau and Osun states ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

This development is intended to support collaboration with European brand owners, converters, and packaging developers.

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Ford's F-Series trucks still had inline-sixes, too. But this was the era where even Mercedes was preparing to ditch its inline-six range in favor of a V layout. So, apart from BMW, the majority of ...

Mamma, Alia Bhatt aims to balance quality and affordability, ensuring parents don’t have to compromise on safety or trust in ...