The entry deadline is fast approaching for the 2026 Australasian Packaging Innovation & Design (PIDA) Awards, which recognise packaging companies and professionals in Australia and New Zealand.

Husky Technologies introduces Hylectric and HyperSync molding platforms designed for sustainable packaging production ...

Industry experts call for domestic sourcing to save struggling US PET recycling infrastructure from imported competition ...

Research authored by partners from the Bottle Consortium and published in Nature Communications this month aims to challenge ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Once packaging leaves the consumer, it enters fragmented collection and sorting systems where contamination, infrastructure gaps, and market forces determine its fate.

When it comes to mastering the art of the travel wardrobe, it’s no surprise that our favorite fashion insiders also moonlight ...

Go Industries Inc, a Texas-based manufacturer with over four decades of experience, announces the expansion of its custom manufacturing and fabrication services to meet growing demand from original ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

Southeast Asia and India will likely emerge as volume-based back-end assembly and test hubs, specializing in select areas of the back-end processes.