Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
When brands talk about “authenticity” in 2026, most still mean influencer partnerships or polished testimonial videos. Jesse Eisenberg means something else entirely: unscripted conversations with real ...
Abstract: In this letter, we propose a novel spherical stochastic geometry (SG)-based analytical framework for characterizing the system-level performance of Long-Range (LoRa)-based low Earth orbit ...
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