Long-Standing Collaboration with UV Relining and SacPro Brings Advanced UV Curing Technology to North American Market ...

Proof of concept uses passive components to redirect heat across a chip, allowing temperature patterns to be used for data processing.

A research team has successfully implemented a programmable spinor lattice on a photonic integrated circuit (PIC). This platform enables the realization of non-Abelian physics, in which the outcome of ...

A team of researchers developed “parallel optical matrix-matrix multiplication” (POMMM), which could revolutionize tensor ...

If you want to see the future of AI, forget the server farms of Northern Virginia or the startup incubators of San Francisco. Go to a car wash company just outside Fort Lauderdale. The intelligence ...

Many hands make light work.

The FBI untangled the mysterious Jan. 6, 2021, pipe bombs case by relying on a “new computer program,” which deciphered cellphone data that the agency had held for years. Earlier this month, the ...

Researchers at Stanford, MIT, and other universities unveiled a new, monolithic 3D processor that could help solve one of the biggest problems facing chipmakers: the processor-memory performance gap.

As artificial intelligence (AI) transitions from cloud-centric operations to edge devices, the hardware that powers AI is undergoing significant change. While graphics processing units (GPUs) have ...

The novel 3D wiring architecture and chip fabrication method enable quantum processing units containing 10,000 qubits to fit in a smaller space than today's 100-qubit chips. When you purchase through ...