They're reference designs for a reason.
Abstract: Fatigue-induced delamination of the direct-bonded copper solder layer is a critical and latent failure mode in multichip insulated gate bipolar transistor (IGBT) power modules. To address ...
Abstract: Transmit/receive (TR) modules in active electronically scanned array radar systems face critical vibration-induced fatigue issues, which are further aggravated by elevated operational ...
"This project is not about powerful hardware or complex graphics." ...