Abstract: Mass reflow soldering technology using flux have been widely adopted in semiconductor assembly process for decades, particularly in ball grid array (BGA) solder ball attachment process.
Solidworks and Inventor receive a lot of attention, and so we tend to forget the surprising number of other MCAD programs that exist. They are not fly-by-nighters – many have been around for more than ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results