The devices are located closest to the many sensors at the edge that gather sensor data, control motors, trigger alarms and actuators, and more.
Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
Trane’s acquisition of LiquidStack and Submer’s latest expansion moves signal a new phase in AI data center growth, where ...
HUMAIN launches HUMAIN Sport through the strategic acquisition of a controlling stake in ai.io, announcing its commitment to ...
Cisco is announcing a suite of capabilities to help enterprises securely adopt AI technology while maintaining agent ...
WESTLAKE VILLAGE, Calif. & BROOMFIELD, Colo., February 09, 2026--Energy Vault Holdings, Inc. (NYSE: NRGV) ("Energy Vault" or ...