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When we talk about the cost of AI infrastructure, the focus is usually on Nvidia and GPUs -- but memory is an increasingly ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

Cisa has added six CVEs to its Kev catalogue this week, including newly-disclosed issues in Google Chromium and Dell ...

IT admins will be busy this month patching Microsoft software and apps, but not nearly as busy as they were in January.

Samsung has advanced LPDDR5X-PIM memory technology and commenced HBM4 mass production as it battles SK Hynix to regain its AI memory market leadership.